Presentation Details
| Understanding the thermomechanical properties of polyolefin encapsulants for reliable perovskite solar module packaging (yes) Marco Casareto1, Nick Bosco2, Laura Schelhas2, Michael Owen-Bellini2, Nicholas Rolston1. 1Arizona State University, Tempe, AZ, USA.2National Laboratory of the Rockies, Golden, CO, USA |
Abstract
The thermomechanical properties of four commercial and experimental grade polyolefin (PO) encapsulants are quantified in order to better understand and mitigate common mechanically-driven degradation mechanisms seen in packaged metal halide perovskite solar modules (PSMs). Test structures (comprised of device test structures) are laminated in glass/PO packages with conductive copper tape adhered to the top electrode. Lamination temperature is also varied to probe if lamination condition, in addition to encapsulant material, affects the thermomechanical robustness of the package. Encapsulant screening is carried out with thermal shock of PSM test structures as a rapid screening method to visualize delamination. The best and worst encapsulants are compared with dynamic mechanical analysis, thermomechanical analysis, and differential scanning calorimetry in order to understand why their performance differs after thermal shock testing. Future work is discussed, including exploring the effect of residual stress, measuring adhesion of encapsulants, and comparing outdoor testing against rapid indoor screening of PSMs to demonstrate how their thermomechanical properties translate to the mechanical robustness of a laminated PSM package in the field. This study highlights the need to characterize encapsulants used in PSM packaging to better instruct industry stakeholders on relevant formulations and properties of encapsulants that can better aid in the commercialization and implementation of PSMs.
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No part of this publication may be reproduced, distributed, or transmitted in any form or by any means, including photocopying, recording, or other electronic or mechanical methods, without the prior written permission of the author.
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