Presentation Details
Silicon heterojunction solar cells with copper contacts metallization by direct printing and CO2 laser sintering

Quang Hao Nguyen1, Ranganathan Kumar1, Aravinda Kar2, Kristopher O.Davis3.

1Department of Mechanical and Aerospace Engineering, University of Central Florida, Orlando, FL, USA.2CREOL, The College of Optics and Photonics, University of Central Florida, Orlando, FL, USA.3Department of Materials Science and Engineering, University of Central Florida, Orlando, FL, USA

Abstract


The high cost and limited availability of silver (Ag) for contact metallization in silicon heterojunction (SHJ) solar cells have motivated alternative approaches. In this work, a direct-write printing method combined with CO2 laser sintering is investigated for copper (Cu) metallization. The printing process is systematically optimized by varying the print speed and standoff distance, yielding uniform Cu fingers with width ~98 μm. The laser sintering process is further studied to understand their impact on the electrical performance and microstructure behavior of the Cu contacts. Scanning electron microscopy (SEM) analysis reveals densification with increasing laser power, achieving a minimum surface porosity of 5.79% at 9.5W. The effect of grid architecture is also evaluated. The serpentine grid with an integrated busbar featured a power conversion efficiency of 20.39% and fill factor of 78.59%. These results demonstrate that direct-write printing combined with laser sintering is a cost-effective and scalable solution to conventional Ag screen-printing for SHJ solar cells.

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