Presentation Details
| Ultra-Thin InGaP Arrays Embedded in Solar Sails for Power Generation and Propulsion Robert F.McCarthy1, Ryan Grady1, David Rowell1, Tyler Gish1, Anastasia Soeriyadi1, Andree Wibowo1, Joseph Footdale2, Roger Welser3, David Wilt4, Noren Pan1. 1MicroLink Devices, Inc., Niles, IL, USA.2Redwire Space, Longmont, CO, USA.3Consultant, Providence, RI, USA.4Consultant, Albuquerque, NM, USA |
Abstract
Electronics near the edge of solar sails require complex, heavy cabling. This cabling can be avoided by implementing embedded photovoltaic (PV) solar power modules (SPM) that are low-mass, high-performance, radiation-hard, and stable in near sun environments. Amorphous Si and CIGSe have been used, but their already low efficiency drops further at high temperature. As an alternative, MicroLink Devices is developing a single junction epitaxial lift-off (ELO) InGaP PV SPM. ELO removes the PV device structure from the growth substrate, providing ~50x mass reduction, ~30% cost reduction, and results in very flexible PV. It further allows for a back surface that reflects ~80% of solar photons (> 650nm), which provides thrust when embedded in the sail, enables low temperature operation in near sun environments (~50oC cooler vs. conventional space PV), and simplifies power management and distribution. MicroLink is aiming for high efficiency under operating conditions (>15% AM0 efficiency, >900 W/kg) with excellent radiation tolerance (<4% drop at 1 x1015 e/cm2, 1 MeV electrons). These features make the proposed cell an ideal candidate for powering distributed electronics. Additional ongoing work focuses on optimization of the power module encapsulation to minimize thickness and weight and designs for SPM embedding and stowage in solar sails.
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