Presentation Details
| Femtosecond Laser Trimming of Screen-Printed Metals to Reduce Grid Finger Width on III-V Solar Cells Thales Borrely1, Elizabeth Garrett1, Jacob Slifka1, AJ Gray1, Sarah Collins1, Theresa E.Saenz1, Thien Truong1, Mirzo Mirzokarimov1, Julian Wagner1, Jacob J.Cordell1, William E.McMahon1, Mitchell Smith2, Melbs LeMieux2, Brett Walker2, David Young1, Myles A.Steiner1. 1National Laboratory of the Rockies, Golden, CO, USA.2Electroninks Inc., Austin, TX, USA |
Abstract
Military operations in space overwhelmingly rely on III-V photovoltaic technology to supply operational energy. To meet growing demands for a wide range of satellite applications of strategic importance to the United States, improvements in cost and throughput are essential, while preserving the high efficiency and reliability of these cells. Current cost-effective metal printing technologies do not meet the 10 µm resolution demands for III-V devices. This work investigates silver ablation with a pulsed femtosecond laser to decrease grid finger width, thus deconvolving the challenges of print resolution and low contact resistance. Selective ablation of screen-printed silver on GaAs substrates was found for 270fs laser pulses with energies ranging from 0.2-5.0 μJ. This laser-material interaction indicates the potential to remove unwanted printed silver from III-V solar cells without damaging underlying active cell layers. Methods and challenges for balancing laser parameters and semiconductor damage are discussed and explored alongside extended growth of thick contact layers to absorb stray laser radiation energy prior to a contact etch. Large areas of III-V photovoltaic panels are essential to supplying operational energy for a growing demand of satellites of strategic importance to the United States military, covering a range of applications.
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No part of this publication may be reproduced, distributed, or transmitted in any form or by any means, including photocopying, recording, or other electronic or mechanical methods, without the prior written permission of the author.
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