Presentation Details
| Screening Encapsulant Properties to Determine Compatibility with Metal-Halide Perovskite Solar Cells and Modules Lucile M.Cerda1, 2, Mostafa Othman1, Oulaya Darbi1, Lisa Champault3, Jonathan Champliaud3, Christian M.Wolff1, Antonin Faes1, 3, Aïcha Hessler-Wyser1, Christophe Ballif1, 3, Soňa Uličná1. 1EPFL, Neuchâtel, Switzerland.2ETHZ, Zürich, Switzerland.3CSEM, Neuchâtel, Switzerland |
Abstract
Metal-halide perovskite (MHP) solar cells surged to popularity in recent years for their potential for high efficiencies, low-cost processability, and compatibility with other photovoltaic (PV) technologies for multi-junction applications. Efforts to improve reliability of the technology through effective encapsulation are on the forefront of perovskite research. To find adequate encapsulant properties for application in MHPs solar cells and modules, we tested several types of commercial PV encapsulants including poly(ethylene co-vinyl acetate) (EVA), polyolefin elastomers (POEs), thermoplastic polyolefin (TPO), and ionomer. We first characterized the encapsulant films to understand their visco-elastic properties (dynamic moving die rheometer (D-MDR)) and compositions (thermogravimetric analysis (TGA), differential scanning calorimetry (DSC)), to optimize lamination conditions. We then tested the films in glass-glass laminates with single-junction (SJ) and tandem solar cells. Indoor accelerated and outdoor testing revealed weaknesses in mechanical robustness of the MHP device interfaces that can be mitigated on both, cell and encapsulant levels. In addition, this screening study resulted in exclusion of one POE encapsulant formulation based on its chemical incompatibility with copper, typically used as rear electrode in SJ devices. Further ageing and material characterizations of encapsulants and cells are ongoing to understand the role of the residual crosslinkers, acetic acid, additives, and mechanical properties on device lifetime. Results will be presented at the conference and serve as a guideline for selection of suitable materials for MHP encapsulation in future studies.
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No part of this publication may be reproduced, distributed, or transmitted in any form or by any means, including photocopying, recording, or other electronic or mechanical methods, without the prior written permission of the author.