IEEE PVSC 49
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SPLTRAK Abstract Submission
Investigating Performance of Emerging Cell Interconnection Technologies using Electroluminescence Imaging and Multi-Irradiance I-V
Dylan J Colvin1,2,3, Fang Li4, Andrew M Gabor5, GovindaSamy TamizhMani4, Kristopher O Davis1,2,3,6
1FSEC Energy Research Center, Cocoa, FL, United States
/2Department of Materials Science and Engineering, University of Central Florida, Orlando, FL, United States
/3Resilient, Intelligent, and Sustainable Energy Systems (RISES) Cluster, University of Central Florida, Orlando, FL, United States
/4Photovoltaic Reliability Laboratory, Arizona State University (ASU-PRL), Mesa, AZ, United States
/5BrightSpot Automation LLC, Westford, MD, United States
/6College of Optics and Photonics, University of Central Florida, Orlando, FL, United States

Innovation of cell interconnection schemes has brought several alternative technologies to the photovoltaics market. The goal of innovation is to maximize performance while minimizing cost and maximizing long-term reliability and durability. Modules representing four interconnection schemes are examined using electroluminescence imaging and multi-irradiance current-voltage and suns-Voc. These technologies are ribbon-tabbed, shingled, soldered wire, and laminated wire. Baseline results are presented.